Technical Tracks

Track 9: Emerging Topics in Networking
Track Co-Chairs:
Ranga Rao Venkatesha Prasad, TU Delft, Netherlands, r.r.venkateshaprasad@tudelft.nl
Richard Li, Southeast University, China, richard.li@seu.edu.cn
Rahman Doost-Mohammady, Rice University, USA, doost@rice.edu

Description:
The track on Emerging Topics in Networking will bring together researchers who are working at the cutting edge of wireless communication, particularly those involving non-traditional communication paradigms. Possible topics of interest are intra-body and implanted networks; wireless networks on chip; quantum communication networks; ultra-broadband communications at true terahertz frequencies; and non-terrestrial and space networks. Contributions that leverage the application of AI tools and methods to improve communications are also welcome, as long as they are aligned to one of these application domains. Works on topics that are physically sound but for which the technology might not be ready yet are expected in this session, including early concept papers with high-risk high-reward ideas.

Track Topics:
• Emerging ultra-high speed and/or ultra-low power PHY/MAC technologies
• Intra-body/implanted networks
• Molecular communications
• Electromagnetic nanonetworks
• Nano-bio interfaces (e.g., optogenetics, optogenomics, brain-machine interfaces)
• Wireless networks on-chip (e.g., graphene antennas, silicon photonics, hyperthreading protocols)
• Big data analytics and data-driven designs for future networking protocols
• Quantum communications and networking (including on-chip wired and wireless links)
• True Terahertz networks
• Intelligent wireless spectrum management systems
• Intelligent reflecting surfaces (e.g., from metasurfaces to orchestration protocols)
• Non-terrestrial and space networks
• Disruptive concepts for the Future Internet
• AI-driven wireless communications and networking
• Semantic communications
• Optical Networking

TPC list:
• Nadjib Aitsaadi, UVSQ Paris-Saclay University, France
• Hans-Peter Bernhard, Silicon Austria Labs/JKU Linz, Austria
• Xenofon Fafoutis, Technical University of Denmark, Denmark
• Markus Fidler, Leibniz Universität Hannover, Germany
• Qiang He, Northeast University, China
• Zhuozhao Li, Southern University of Science and Technology, China
• Bo Liu, Southeast University, China
• Changqing Luo, Virginia Commonwealth University, USA
• Jianping Pan, University of Victoria, Canada
• Zhijin Qin, Tsinghua University, China
• Jiacheng Shang, Montclair State University, USA
• Masoud Shokrnezhad, University of Oulu, Finland
• Herbert Song, University of Maryland Baltimore County, USA
• Antonio Virdis, University of Pisa, Italy
• Tao Wang, New Mexico State University, USA
• Cedric Westphal, University of California, Santa Cruz, USA
• Qichao Xu, Shanghai University, China
• Yuchao Zhang, Beijing University of Posts and Telecommunications, China
• Shangqing Zhao, University of Oklahoma, USA
• Dongbiao He, Chinese Academy of Sciences, China