Technical Tracks

Track 3: IoT and Cyber-Physical Systems
Track Co-Chairs:
Qiben Yan, Michigan State University, USA, qyan@msu.edu
Christoph Sommer, TU Dresden, Germany, sommer@cms-labs.org

Description:
The Internet of Things (IoT) and Cyber-Physical Systems (CPS) are at the center of today’s “smart” revolution where digital connectivity permeates everyday life and enables applications from tiny smart objects, smart wearables, smart cars, smart trucks, smart drones, smart buildings, and smart factories, all the way to smart transport and smart power systems and smart cities. In all of these applications, computer communications and networking play a key role to enable not just efficient low-latency communication, but also robust and resilient systems. Over the last decade, significant and exciting advances in computing and communication technologies have redefined the vision, frontiers, and challenges of IoT and CPS research. IoT is generally characterized by limited energy, computation and communication capacity, the presence of sensors in tiny objects, and the associated challenges, e.g., concerning security, energy efficiency, data caching, storage, and sharing. CPS are physical and engineered systems whose operations are monitored, coordinated, controlled, and integrated by computing and communication. The emerging environment is further becoming more complex and challenging, due to the heterogeneity of the involved devices, resources and application domain, giving rise to several interesting aspects in the era of interoperability and flexibility. Additional challenges lie in robustness and resilience, time sensitivity, resource constraints, heterogeneity, and human interaction with machines. To address all the challenges, theoretical and experimental approaches at both the network and system levels are invaluable. In this track, we invite submissions of research works with novel contributions of either type.

Track Topics:
  • V2X communications and connected vehicular networks
  • Smart Grid
  • Smart buildings
  • Smart manufacturing/assembly
  • Smart city
  • Transport logistics
  • Robustness
  • Resilience
  • Tactile Internet
  • Time sensitive networking
  • Fault tolerance, reliability and survivability
  • Interoperability Issues
  • Energy-efficient networking
TPC List:
  • Bastian Bloessl, TU Darmstadt, Germany
  • Carlos Calafate, Universitat Politècnica de València, Spain
  • Maria Calderon, Universidad Carlos III de Madrid, Spain
  • Zhenxiang Chen, university of Jinan, China
  • Mauro Conti, Padova University, Italy
  • Anatoli Djanatliev, Friedrich-Alexander University Erlangen-Nuremberg, Germany
  • Zheng Dong, Wayne State University, USA
  • Anna Förster, University of Bremen, Germany
  • Saim Ghafoor, Letterkenny Institute of Technology, Ireland
  • Zhangyu Guan, University at Buffalo, USA
  • Linke Guo, Clemson University, USA
  • Florian Klingler, Paderborn University, Germany
  • Anis Laouiti, Telecom sudParis, France
  • Ming Li, University of Arizona, USA
  • Ang Li, Duke University, USA
  • Zhen Ling, Southeast University, China
  • Jian Liu, University of Tennessee, Knoxville, USA
  • Vittorio Rampa, ieiit, Italy
  • Marc St-Hilaire, Carleton University, Canada
  • Ion Turcanu, Luxembourg Institute of Science and Technology (LIST), Luxembourg
  • Alexey Vinel, Halmstad University, Sweden
  • Qingyang Wang, Louisiana State University -- Baton Rouge, USA
  • Yang Xiao, University of Kentucky, USA
  • Liang Xiao, Xiamen University, China
  • Jie Yang, FSU, USA
  • Rui Zhang, University of Delaware, USA